Part Image

ADC3221IRGZT - Texas Instruments

Description: Dual-Channel, 12-Bit, 25-MSPS Analog-to-Digital Converter (ADC)

Download ADC3221IRGZT Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
ADC3221IRGZT - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGZ0048D
click to zoom
3D Models
ADC3221IRGZT - Texas Instruments  - 3D model - Quad Flat No-Lead - RGZ0048D
click to zoom

ADC3221IRGZT Details

  • Manufacturer Part Number:

    ADC3221IRGZT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    HVQCCN-48

  • Pin Count:

    48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Peak-to-peak input voltage range(V) : 2

  • Analog Input Voltage-Max:

    2 V

  • Analog Input Voltage-Min:

    -2 V

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-PQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    2

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    25 MHz

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    81 mA

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

ADC3221IRGZT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a layout guide and PCB design checklist in the ADC3221 datasheet and application notes. It's essential to follow these guidelines to minimize noise, ensure signal integrity, and achieve optimal performance. Key considerations include keeping analog and digital signals separate, using a solid ground plane, and minimizing trace lengths and impedance mismatches.
  • The ADC3221IRGZT requires a high-speed clock input (up to 100 MHz) to operate. The clock source should be a low-jitter, high-frequency clock with a stable amplitude. Texas Instruments recommends using a clock source with a jitter of less than 100 ps and an amplitude of 1.8 V to 3.3 V. The clock input should be properly terminated and routed to minimize signal degradation and noise coupling.
  • Proper power supply decoupling and filtering are crucial for the ADC3221IRGZT's performance. Texas Instruments recommends using a multi-stage decoupling scheme with a combination of ceramic and electrolytic capacitors. A pi-filter or a ferrite bead can be used to filter out high-frequency noise. The power supply should be well-regulated and have a low noise floor to ensure optimal ADC performance.
  • The ADC3221IRGZT can be interfaced with a microcontroller or FPGA using a parallel or serial interface. Key considerations include ensuring proper data transfer and synchronization, handling data formatting and byte ordering, and managing interrupts and data ready signals. Texas Instruments provides example code and interface guidelines in the datasheet and application notes.
  • The ADC3221IRGZT has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat dissipation and thermal management. This can be achieved through proper PCB design, using thermal vias, and providing adequate airflow or heat sinking. Texas Instruments provides thermal resistance and power dissipation data in the datasheet to aid in thermal design.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

ADC3221IRGZT Overview

Use the download button to access the ADC3221IRGZT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ADC32, or try a keyword search, such as Analog to Digital Converters

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to ADC3221IRGZT

Showing 0 results