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ADS4229IRGCR - Texas Instruments

Description: 2-Channel Dual ADC Pipelined 250Msps 12-bit Parallel/LVDS 64-Pin VQFN EP T/R

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PCB Footprints
ADS4229IRGCR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGC0064H
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3D Models
ADS4229IRGCR - Texas Instruments  - 3D model - Quad Flat No-Lead - RGC0064H
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ADS4229IRGCR Details

  • Manufacturer Part Number:

    ADS4229IRGCR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    HVQCCN-64

  • Pin Count:

    64

  • ECCN Code:

    3A991.C.2

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Peak-to-peak input voltage range(V) : 2

  • Analog Input Voltage-Max:

    2 V

  • Analog Input Voltage-Min:

    -2 V

  • Converter Type:

    ADC, FLASH METHOD

  • JESD-30 Code:

    S-PQCC-N64

  • JESD-609 Code:

    e4

  • Length:

    9 mm

  • Linearity Error-Max (EL):

    0.0977%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    2

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC64,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    250 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    190 mA

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    9 mm

ADS4229IRGCR Frequently Asked Questions (FAQs)

  • A good PCB layout for the ADS4229IRGCR involves keeping analog and digital traces separate, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog ground plane to reduce noise and improve performance.
  • To optimize the clock input, use a high-quality clock source with low jitter, and ensure the clock signal is properly terminated. Additionally, use a clock frequency that is a multiple of the sampling frequency to minimize jitter. It's also recommended to use a clock signal with a 50% duty cycle to minimize clock skew.
  • The recommended power-up sequence for the ADS4229IRGCR is to first apply the analog power supply (AVDD), followed by the digital power supply (DVDD), and finally the clock signal. This sequence helps prevent damage or malfunction due to incorrect power-up sequencing.
  • To handle the output data from the ADS4229IRGCR, use a FIFO or a data buffer to synchronize the data with the clock signal. Ensure that the data is aligned to the correct byte boundary, and use the device's built-in features such as data formatting and byte swapping to simplify data processing.
  • The ADS4229IRGCR has a maximum junction temperature of 150°C. To ensure reliable operation over temperature, ensure good thermal conductivity between the device and the PCB, use thermal vias to dissipate heat, and avoid overheating the device. Additionally, consider using thermal simulation tools to optimize the thermal design.

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ADS4229IRGCR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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