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ADS54RF63IPFPR - Texas Instruments

Description: 12-Bit ADC

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PCB Footprints
ADS54RF63IPFPR - Texas Instruments PCB footprint - Other - Other - QFP50P1400X1400X120-81N
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3D Models
ADS54RF63IPFPR - Texas Instruments  - 3D model - Other - QFP50P1400X1400X120-81N
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ADS54RF63IPFPR Details

  • Manufacturer Part Number:

    ADS54RF63IPFPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    80

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    3A001.A.5.A.3

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Peak-to-peak input voltage range(V) : 2.2

  • Analog Input Voltage-Max:

    2.2 V

  • Analog Input Voltage-Min:

    -2.2 V

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-PQFP-G80

  • JESD-609 Code:

    e4

  • Length:

    12 mm

  • Linearity Error-Max (EL):

    0.1099%

  • Moisture Sensitivity Level:

    4

  • Number of Analog In Channels:

    1

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    80

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTFQFP

  • Package Equivalence Code:

    TQFP80,.55SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    550 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    340 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    12 mm

ADS54RF63IPFPR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the center of the board, and the analog and digital sections should be separated to minimize noise coupling.
  • The clocking scheme should be optimized to minimize jitter and ensure proper synchronization. A low-jitter clock source, such as a crystal oscillator, should be used, and the clock signal should be routed close to the device to minimize noise.
  • The recommended power-up sequence is to first apply the analog power supply (AVDD), followed by the digital power supply (DVDD), and then the clock signal. This ensures that the device powers up correctly and minimizes the risk of latch-up.
  • The device should be mounted on a heat sink or a thermal pad to dissipate heat. The PCB should be designed to allow for good airflow, and thermal vias can be used to dissipate heat from the device to the PCB.
  • The recommended filter configuration depends on the specific application, but a 5th-order Butterworth filter or a 7th-order elliptical filter are commonly used. The filter should be designed to minimize group delay and ensure a flat frequency response.

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ADS54RF63IPFPR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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