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AMC1303M2510DWV - Texas Instruments

Description: ±250 mV-Input, Reinforced Isolated Modulator with 10 MHz Internal Clock and CMOS Interface

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AMC1303M2510DWV - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWV0008A-1
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AMC1303M2510DWV - Texas Instruments  - 3D model - Small Outline Packages - DWV0008A-1
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AMC1303M2510DWV Details

  • Manufacturer Part Number:

    AMC1303M2510DWV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2017-06-25

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Peak-to-peak input voltage range(V) : 250mV

  • Analog Input Voltage-Max:

    0.25 V

  • Analog Input Voltage-Min:

    -0.25 V

  • Converter Type:

    ADC, DELTA-SIGMA

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    7.5 mm

  • Linearity Error-Max (EL):

    0.0061%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    10 MHz

  • Seated Height-Max:

    2.8 mm

  • Supply Current-Max:

    9.8 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5.85 mm

AMC1303M2510DWV Frequently Asked Questions (FAQs)

  • A good PCB layout for the AMC1303M2510DWV involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help reduce noise and improve performance.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves applying a known input voltage and adjusting the internal offset and gain registers accordingly. Additionally, consider using an external calibration voltage source and a precision resistor network to improve accuracy.
  • The AMC1303M2510DWV has a maximum junction temperature of 150°C. To ensure reliable operation, ensure good thermal conductivity between the device and the PCB, use a heat sink if necessary, and avoid exceeding the maximum power dissipation. Also, consider using thermal simulation tools to model the thermal performance of your design.
  • The AMC1303M2510DWV's internal oscillator can be used as a clock source, but it may not provide the same level of accuracy as an external clock source. If using an external clock source, ensure it meets the device's clock input requirements, and consider using a clock buffer to improve signal integrity.
  • To ensure electromagnetic compatibility, follow proper PCB layout and shielding techniques, use a metal shield around the device, and consider using EMI filters or common-mode chokes to reduce emissions. Additionally, ensure that the device is properly decoupled and that the power supply is well-regulated.

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AMC1303M2510DWV Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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