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AMC1304M25DW - Texas Instruments

Description: Reinforced Isolated Modulator With LDO Regulator, ±250mV Input, and CMOS Interface

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AMC1304M25DW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW (R-PDSO-G16)
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3D Models
AMC1304M25DW - Texas Instruments  - 3D model - Small Outline Packages - DW (R-PDSO-G16)
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AMC1304M25DW Details

  • Manufacturer Part Number:

    AMC1304M25DW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Peak-to-peak input voltage range(V) : 250mV

  • Analog Input Voltage-Max:

    0.0625 V

  • Analog Input Voltage-Min:

    -0.0625 V

  • Converter Type:

    ADC, DELTA-SIGMA

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    10.3 mm

  • Linearity Error-Max (EL):

    0.006103%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    1

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    20 MHz

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    5.5 mA

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

AMC1304M25DW Frequently Asked Questions (FAQs)

  • A good PCB layout for the AMC1304M25DW involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help to reduce noise and improve performance.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves applying a known input voltage and adjusting the internal offset and gain registers accordingly. Additionally, consider using an external calibration voltage source and a precision resistor network to improve accuracy.
  • Operating the AMC1304M25DW beyond the recommended temperature range may affect its performance, accuracy, and reliability. The device may experience reduced accuracy, increased noise, and potentially even damage or failure. It is essential to ensure the device operates within the recommended temperature range to maintain optimal performance and reliability.
  • The AMC1304M25DW requires a stable clock source to operate correctly. Use a high-quality clock source, such as a crystal oscillator or a high-precision clock generator, and ensure the clock signal is properly routed and decoupled to minimize jitter and noise. Additionally, consider using the device's internal clock synchronization features to ensure proper data synchronization.
  • To mitigate EMI and RFI when using the AMC1304M25DW, use proper shielding, grounding, and decoupling techniques. Ensure the device is placed in a shielded enclosure, and use EMI filters or common-mode chokes to reduce emissions. Additionally, consider using a low-pass filter or a ferrite bead to reduce high-frequency noise.

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AMC1304M25DW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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