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BQ25120AYFPT - Texas Instruments

Description: 700nA Low Iq Highly Integrated Battery Charge Management Solution

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BQ25120AYFPT - Texas Instruments - PCB symbol
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PCB Footprints
BQ25120AYFPT - Texas Instruments PCB footprint - BGA - BGA - YFP0025
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3D Models
BQ25120AYFPT - Texas Instruments - 3D model - BGA - YFP0025
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BQ25120AYFPT Details

  • Manufacturer Part Number:

    BQ25120AYFPT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2017-07-31

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    BATTERY MONITOR/PROTECTOR

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.4 V

  • JESD-30 Code:

    R-XBGA-B25

  • JESD-609 Code:

    e1

  • Length:

    2.53 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA25,5X5,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3.4 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.468 mm

BQ25120AYFPT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the IC, and use short, wide traces for the power paths. Avoid routing sensitive analog signals near the switching node.
  • Choose an inductor with a high saturation current rating, low DC resistance, and a suitable inductance value (e.g., 1-2.2 μH). Consider the inductor's physical size, core material, and operating frequency when selecting the optimal inductor for your design.
  • Use a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 4.7 μF and 10 μF. The capacitor should be placed close to the VIN pin and have a voltage rating of at least 6.3 V.
  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the IC, and avoid blocking the thermal pad. Monitor the junction temperature (TJ) and adjust the design as needed to keep TJ below 125°C.
  • Use a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 4.7 μF and 10 μF. The capacitor should be placed close to the VOUT pin and have a voltage rating of at least 2.5 V.

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BQ25120AYFPT Overview

Use the download button to access the BQ25120AYFPT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BQ251, or try a keyword search, such as Power Management Circuits

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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