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BQ25120YFPR - Texas Instruments

Description: Battery Management 700na Low Iq Battery Charge Mngt

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PCB Footprints
BQ25120YFPR - Texas Instruments PCB footprint - BGA - BGA - YFP (S-XBGA-N25)
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3D Models
BQ25120YFPR - Texas Instruments  - 3D model - BGA - YFP (S-XBGA-N25)
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BQ25120YFPR Details

  • Manufacturer Part Number:

    BQ25120YFPR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    3.9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    BATTERY MONITOR/PROTECTOR

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.4 V

  • JESD-30 Code:

    R-PBGA-B25

  • JESD-609 Code:

    e1

  • Length:

    2.53 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA25,5X5,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.5 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3.4 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.468 mm

BQ25120YFPR Frequently Asked Questions (FAQs)

  • A good PCB layout for the BQ25120YFPR involves placing the device close to the battery, using a solid ground plane, and keeping the input and output capacitors close to the device. Additionally, it's recommended to use a separate power plane for the battery and the system, and to minimize the length of the traces between the device and the capacitors.
  • The selection of external components for the BQ25120YFPR depends on the specific application requirements. For example, the input capacitor should be selected based on the input voltage and current requirements, while the output capacitor should be selected based on the output voltage and current requirements. The datasheet provides guidelines for selecting the external components, and TI also provides a web-based tool to help with component selection.
  • The BQ25120YFPR has a thermal shutdown feature that turns off the device when the junction temperature exceeds 150°C. To ensure reliable operation, it's recommended to keep the device junction temperature below 125°C. This can be achieved by providing adequate heat sinking, using a thermal pad, and ensuring good airflow around the device.
  • Troubleshooting issues with the BQ25120YFPR involves checking the input voltage, output voltage, and current consumption. It's also recommended to check the device's thermal performance, and to verify that the external components are properly selected and connected. TI also provides a troubleshooting guide and application notes to help with debugging.
  • The BQ25120YFPR is designed to minimize EMI, but it's still important to follow good PCB layout practices to minimize radiation. This includes using a solid ground plane, keeping the input and output traces short, and using shielding if necessary. Additionally, it's recommended to use a common-mode choke and a ferrite bead to filter the input and output signals.

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BQ25120YFPR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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