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BQ29312ARTHR - Texas Instruments

Description: Battery Protection Li-Ion/Li-Pol 0.2mA 25V 24-Pin VQFN EP T/R

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PCB Footprints
BQ29312ARTHR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RTH(S-PVQFN-N24)
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3D Models
BQ29312ARTHR - Texas Instruments  - 3D model - Quad Flat No-Lead - RTH(S-PVQFN-N24)
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BQ29312ARTHR Details

  • Manufacturer Part Number:

    BQ29312ARTHR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    BATTERY PROTECTOR

  • Input Voltage-Max:

    25 V

  • JESD-30 Code:

    S-PQCC-N24

  • JESD-609 Code:

    e4

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    5

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    25 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    14 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

BQ29312ARTHR Frequently Asked Questions (FAQs)

  • A good PCB layout for the BQ29312ARTHR involves keeping the high-current paths short and wide, using multiple vias to connect the thermal pad to the ground plane, and placing the input capacitors close to the device. A 4-layer PCB with a solid ground plane is recommended.
  • Proper thermal management involves attaching a heat sink to the device, using thermal interface material to fill gaps, and ensuring good airflow around the device. The thermal pad should be connected to a solid ground plane to dissipate heat efficiently.
  • Not using the recommended input capacitors can lead to reduced efficiency, increased output voltage ripple, and potentially even device failure. The input capacitors help to filter the input voltage and reduce the impact of input voltage transients.
  • The BQ29312ARTHR is rated for operation up to 125°C, but the device's performance and reliability may be affected at high temperatures. It's essential to consider the device's thermal management and derate the device's current capability at high temperatures.
  • To troubleshoot issues with the BQ29312ARTHR, start by checking the input voltage, output voltage, and current. Verify that the device is properly connected and that the input capacitors are installed correctly. Use an oscilloscope to check for voltage transients and ringing.

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BQ29312ARTHR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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