FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
Screening Level:
AEC-Q100
Seated Height-Max:
1.2 mm
Supply Current-Max (Isup):
11.6 mA
Supply Voltage-Max (Vsup):
80 V
Supply Voltage-Min (Vsup):
9 V
Surface Mount:
YES
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Threshold Voltage-Nom:
+1.65V
Time@Peak Reflow Temperature-Max (s):
30
Width:
10 mm
BQ79614PAPRQ1 Frequently Asked Questions (FAQs)
A 4-layer PCB with a solid ground plane and a separate layer for the high-voltage traces is recommended. Keep the high-voltage traces short and away from the low-voltage traces. Use a thermal relief pattern for the thermal pad to ensure good thermal conductivity.
Use the TI-provided software development kit (SDK) and configuration tool to generate the necessary configuration files for your specific BMS application. Consult the user's guide and application notes for guidance on configuring the device.
Choose components with suitable voltage and current ratings, and consider the operating temperature range and tolerance. For resistors, use 1% or better tolerance, and for capacitors, use X7R or X5R dielectrics. Consult the datasheet and application notes for specific recommendations.
Use the built-in diagnostic features, such as the fault register and status registers, to identify the source of the issue. Consult the datasheet and application notes for troubleshooting guidelines and use TI's support resources, such as the E2E forum, for additional assistance.
Use a thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Monitor the device temperature using the built-in temperature sensor and adjust the system design as needed to maintain a safe operating temperature.
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BQ79614PAPRQ1 Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
