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CC1101IRHBRG4Q1 - Texas Instruments

Description: Low-Power Sub-1-GHz Fractional-N UHF Device Family for Automotive

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CC1101IRHBRG4Q1 - Texas Instruments - PCB symbol
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PCB Footprints
CC1101IRHBRG4Q1 - Texas Instruments PCB footprint - Other - Other - QFN50P500X500X100-33N
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3D Models
CC1101IRHBRG4Q1 - Texas Instruments - 3D model - Other - QFN50P500X500X100-33N
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CC1101IRHBRG4Q1 Details

  • Manufacturer Part Number:

    CC1101IRHBRG4Q1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    5 X 5 MM, GREEN, PLASTIC, MO-220, QFN-32

  • Pin Count:

    32

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    RF AND BASEBAND CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

CC1101IRHBRG4Q1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the CC1101 datasheet, but it's also recommended to follow the guidelines in the 'CC1101 PCB Layout Guidelines' application note (SWRA122). This note provides detailed information on how to design a PCB that minimizes noise and interference.
  • The CC1101 has many configuration options that can affect its range and sensitivity. TI provides a 'CC1101 Range and Sensitivity Optimization' application note (SWRA123) that guides you through the process of optimizing the device for your specific application. Additionally, the SmartRF Studio software can be used to simulate and optimize the performance of the CC1101.
  • The maximum transmission power of the CC1101 is +10 dBm, but this can be limited by the regulatory requirements of the region in which the device is operating. It's also important to note that the transmission power can be adjusted through the device's registers to optimize power consumption and range.
  • The CC1101 supports frequency hopping, but it requires external control and synchronization. TI provides an 'FHSS (Frequency Hopping Spread Spectrum) with the CC1101' application note (SWRA124) that explains how to implement frequency hopping using an external microcontroller and the CC1101.
  • The latency of the CC1101 depends on the mode of operation and the configuration of the device. In general, the latency is around 2-3 ms for transmission and reception, but this can be affected by factors such as the data rate, modulation scheme, and packet size.

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CC1101IRHBRG4Q1 Overview

Use the download button to access the CC1101IRHBRG4Q1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CC110, or try a keyword search, such as Cellular Telephone Circuits

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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