The recommended PCB footprint for the CMF552K0000FHEK is a rectangular pad with dimensions of 5.08 mm x 3.81 mm, with a thermal pad of 2.54 mm x 2.54 mm in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) area around the thermal pad.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 221°C. Apply a small amount of solder paste to the PCB pads, and use a reflow oven or a hot air gun to solder the component. Avoid using excessive solder or flux, as it can cause shorts or damage to the component.
The maximum operating temperature range for the CMF552K0000FHEK is -55°C to 150°C. However, the component's performance and reliability may degrade if operated at temperatures above 125°C for extended periods.
Handle the CMF552K0000FHEK with care to avoid damage. Store the components in their original packaging or in a dry, cool place, away from direct sunlight and moisture. Avoid bending, flexing, or applying excessive pressure to the component's leads or body.
The recommended torque for the CMF552K0000FHEK's mounting screws is 0.5 Nm to 1.5 Nm. Over-tightening can damage the component or the PCB, while under-tightening can cause the component to loosen during operation.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
CMF552K0000FHEK Overview
Use the download button to access the CMF552K0000FHEK schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CMF55,
or try a keyword search, such as Metal Film Resistors