Part Image

D2516ECMDXGJD-U - Kingston Technology

Description: DRAM Chip DDR3L SDRAM 4Gbit 256Mx16 1.35V 96-Pin FBGA

Download D2516ECMDXGJD-U Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
D2516ECMDXGJD-U - Kingston Technology PCB footprint - BGA - BGA - 96-ball FBGA
click to zoom
3D Models
D2516ECMDXGJD-U - Kingston Technology  - 3D model - BGA - 96-ball FBGA
click to zoom

D2516ECMDXGJD-U Details

  • Manufacturer Part Number:

    D2516ECMDXGJD-U

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-96

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.36

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Kingston Technology Company

  • YTEOL:

    4

  • Access Mode:

    MULTI BANK PAGE BURST

  • Access Time-Max:

    20 ns

  • Clock Frequency-Max (fCLK):

    934 MHz

  • I/O Type:

    COMMON

  • Interleaved Burst Length:

    4,8

  • JESD-30 Code:

    R-PBGA-B96

  • Length:

    13.5 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    DDR3L DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    96

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    95 °C

  • Organization:

    256MX16

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA96,9X16,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Refresh Cycles:

    8192

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Sequential Burst Length:

    4,8

  • Standby Current-Max:

    0.028 A

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage-Max (Vsup):

    1.45 V

  • Supply Voltage-Min (Vsup):

    1.283 V

  • Supply Voltage-Nom (Vsup):

    1.35 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    7.5 mm

D2516ECMDXGJD-U Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the D2516ECMDXGJD-U is 0°C to 85°C, with a storage temperature range of -40°C to 100°C.
  • To ensure data integrity, it's recommended to use a power-fail interrupt (PFI) signal to detect power failures and initiate a shutdown sequence. Additionally, implementing a capacitor or supercapacitor on the power rail can help maintain power to the module during a power failure.
  • The D2516ECMDXGJD-U is designed to support up to 500 insertion cycles, making it suitable for applications that require frequent module removal and reinsertion.
  • The D2516ECMDXGJD-U is designed to operate at a voltage range of 1.35V to 1.45V, so it's not recommended to use it with a 1.2V power supply. Using a lower voltage may affect the module's performance and reliability.
  • The typical power consumption of the D2516ECMDXGJD-U is around 2.5W during idle mode and up to 4.5W during active mode, depending on the specific usage scenario and operating frequency.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

D2516ECMDXGJD-U Overview

Use the download button to access the D2516ECMDXGJD-U schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like D2516, or try a keyword search, such as DRAMs

Parts related to D2516ECMDXGJD-U

Showing 0 results