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DS14C335MSAX - Texas Instruments

Description: RS-232 Interface IC +3.3V Supply TIA/EIA - 232 3X5 Driver/Receiver 28-SSOP 0 to 70

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DS14C335MSAX - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DB (R-PDSO-G28)
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DS14C335MSAX Details

  • Manufacturer Part Number:

    DS14C335MSAX

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Package Description:

    EIAJ TYPE2, PLASTIC, SSOP-28

  • Pin Count:

    28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    1 RECEIVER ACTIVE UNDER SHUTDOWN; EXTERNAL CHARGE PUMP

  • Differential Output:

    NO

  • Driver Number of Bits:

    3

  • High Level Input Current-Max:

    0.000001 A

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232-E; TIA-232-E; V.28

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e0

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    4

  • Number of Functions:

    3

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    10 V

  • Output Low Current-Max:

    0.002 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    1000 ns

  • Receiver Number of Bits:

    5

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    20 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Transmit Delay-Max:

    1000 ns

  • Width:

    5.3 mm

DS14C335MSAX Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-speed design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias near the device. Additionally, ensure that the input and output traces are well-matched and impedance-controlled.
  • The DS14C335MSAX requires a specific power sequencing order to prevent damage. Ensure that the VCC supply is powered up before the VCCA supply, and that both supplies are powered down in the reverse order. Additionally, ensure that the input signals are not applied until both supplies are stable.
  • The maximum cable length supported by the DS14C335MSAX depends on the specific application and the type of cable used. As a general guideline, Texas Instruments recommends keeping the cable length below 10 meters to ensure reliable operation. However, it's essential to perform signal integrity analysis and testing to determine the maximum cable length for your specific use case.
  • To optimize the device's performance for high-frequency operation, ensure that the input and output signals are properly terminated, and that the device is operated within its recommended operating conditions. Additionally, consider using a low-jitter clock source, and ensure that the power supplies are well-regulated and decoupled.
  • The DS14C335MSAX is a high-speed device that can generate significant heat. Ensure that the device is mounted on a heat sink or a thermally conductive PCB material, and that there is adequate airflow around the device. Additionally, consider using thermal interface materials to improve heat transfer between the device and the heat sink.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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