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DS25MB100TSQ/NOPB - Texas Instruments

Description: 2.5 Gbps 2:1/1:2 CML Mux/Buffer with Transmit Pre-Emphasis and Receive Equalization

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DS25MB100TSQ/NOPB Details

  • Manufacturer Part Number:

    DS25MB100TSQ/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WQFN-36

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    S-XQCC-N36

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.1 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC36,.25SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    1 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.465 V

  • Supply Voltage1-Min:

    3.15 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1 ns

  • Width:

    6 mm

DS25MB100TSQ/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a PCB layout with a solid ground plane, short signal traces, and minimal vias to reduce signal reflections and noise. A 4-layer PCB with a dedicated ground plane is recommended for high-speed signals.
  • To ensure signal integrity, use a controlled impedance PCB, maintain a consistent signal trace width, and use terminations as recommended in the datasheet. Also, minimize the number of vias and use a signal integrity analysis tool to simulate and optimize the design.
  • The maximum cable length supported by the DS25MB100TSQ/NOPB depends on the signal frequency, cable type, and termination. As a general guideline, Texas Instruments recommends a maximum cable length of 10 inches (25 cm) for signals up to 100 MHz and 5 inches (13 cm) for signals up to 200 MHz.
  • To handle power sequencing and supply noise, use a power supply with a low noise output, and ensure that the power supply is stable before applying signals to the device. Use a power sequencing scheme that ensures the device is powered up and down in a controlled manner to prevent latch-up or damage.
  • The DS25MB100TSQ/NOPB has a maximum junction temperature of 150°C. To ensure reliable operation, maintain a maximum ambient temperature of 85°C, and use a heat sink or thermal pad to dissipate heat if the device is expected to operate at high temperatures or high power levels.

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DS25MB100TSQ/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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