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DS26F32MJRQMLV - Texas Instruments

Description: Quad Receiver RS-422/RS-423 16-Pin CDIP Tube

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DS26F32MJRQMLV - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - NFE0016A
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DS26F32MJRQMLV - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - NFE0016A
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DS26F32MJRQMLV Details

  • Manufacturer Part Number:

    DS26F32MJRQMLV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    LG_MAX; SEATED HGT-NOM

  • High Level Input Current-Max:

    0.00005 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-422; EIA-423; FED STD 1020; FED STD 1030

  • JESD-30 Code:

    R-GDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.94 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Out Swing-Min:

    2.1 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.00005 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    31 ns

  • Receiver Number of Bits:

    4

  • Screening Level:

    MIL-PRF-38535 Class V

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    50 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Total Dose:

    100k Rad(Si) V

  • Width:

    7.62 mm

DS26F32MJRQMLV Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal relief pattern can help to dissipate heat efficiently.
  • To ensure reliable operation across the full temperature range, it's essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure that the device is properly soldered and connected. Additionally, consider using a thermocouple or temperature sensor to monitor the device temperature and adjust the system design accordingly.
  • The recommended power sequencing involves applying the analog supply voltage (AVDD) before the digital supply voltage (DVDD). Ensure that the power supplies are well-regulated and filtered to minimize noise and ripple. Also, consider using a power-on reset (POR) circuit to ensure a clean power-up sequence.
  • To optimize the device's performance for low-power operation, consider using the lowest possible clock frequency, disabling unused features and peripherals, and using the power-down mode when the device is not in use. Additionally, optimize the system's power management scheme to minimize power consumption during idle periods.
  • To mitigate EMI and RFI, use a multi-layer PCB with a solid ground plane, and ensure that the device is properly shielded and filtered. Use EMI filters, such as ferrite beads or common-mode chokes, to reduce electromagnetic radiation. Additionally, consider using a shielded enclosure or a metal can to further reduce EMI and RFI.

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DS26F32MJRQMLV Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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