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DS90C363MTD - Texas Instruments

Description: LVDS Interface IC 3.3-V programmable LVDS transmitter 18-bit flat panel display (FPD-Link) - 65 MHz 48-TSSOP

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DS90C363MTD - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG0048A/202-1
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DS90C363MTD - Texas Instruments  - 3D model - Small Outline Packages - DGG0048A/202-1
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DS90C363MTD Details

  • Manufacturer Part Number:

    DS90C363MTD

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TSSOP-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    3

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e0

  • Length:

    12.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    3

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.25 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Low Current-Max:

    0.002 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    55 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    6.1 mm

DS90C363MTD Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout guide in the DS90C363MTD evaluation module documentation, which includes guidelines for component placement, routing, and thermal management.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow the thermal management guidelines in the datasheet, including using a heat sink, thermal interface material, and ensuring good airflow around the device.
  • The maximum cable length supported by the DS90C363MTD depends on the specific application and the type of cable used. However, as a general guideline, Texas Instruments recommends keeping the cable length below 10 meters to ensure reliable operation.
  • To troubleshoot issues with the DS90C363MTD, it is recommended to use oscilloscopes and logic analyzers to capture and analyze the signals, and to consult the device's datasheet and application notes for guidance on signal integrity and data transmission.
  • Yes, the DS90C363MTD can be used in a multi-drop bus configuration, but it requires careful consideration of the bus loading, signal integrity, and data transmission protocols to ensure reliable operation.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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