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DS90C363MTDX/NOPB - Texas Instruments

Description: LVDS Flat Panel Display 1300Mbps 0.45V 48-Pin TSSOP T/R

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DS90C363MTDX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG0048A
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DS90C363MTDX/NOPB Details

  • Manufacturer Part Number:

    DS90C363MTDX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TSSOP

  • Pin Count:

    48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    1997-06-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    3.9

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    12.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.25 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Low Current-Max:

    0.002 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    55 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

DS90C363MTDX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-speed design practices, such as using a solid ground plane, minimizing trace lengths, and using 50-ohm transmission lines.
  • To ensure signal integrity, use controlled impedance traces, minimize vias and stubs, and use termination resistors as recommended in the datasheet. Additionally, simulate your design using tools like IBIS or SPICE to verify signal integrity.
  • The maximum cable length supported by the DS90C363MTDX/NOPB depends on the specific application and the type of cable used. As a general guideline, the datasheet recommends a maximum cable length of 10 meters for FPD-Link III applications.
  • To troubleshoot issues with the DS90C363MTDX/NOPB, use a logic analyzer or oscilloscope to verify signal integrity and timing. Check the power supply voltage, clock frequency, and data transmission rates to ensure they are within the recommended specifications.
  • While the DS90C363MTDX/NOPB is optimized for FPD-Link III applications, it can be used in other high-speed digital applications with proper design and verification. However, Texas Instruments may not provide full support or guarantee compatibility in non-FPD-Link III applications.

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DS90C363MTDX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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