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DS90CF363BMT/NOPB - Texas Instruments

Description: +3.3V Programmable LVDS Transmitter 18-Bit Flat Panel Display (FPD) Link - 65MHz

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DS90CF363BMT/NOPB - Texas Instruments - PCB symbol
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PCB Footprints
DS90CF363BMT/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G48)
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DS90CF363BMT/NOPB - Texas Instruments - 3D model - Small Outline Packages - DGG (R-PDSO-G48)
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DS90CF363BMT/NOPB Details

  • Manufacturer Part Number:

    DS90CF363BMT/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    3

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e3

  • Length:

    12.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    3

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -10 °C

  • Out Swing-Min:

    0.25 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    55 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

DS90CF363BMT/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the DS90CF363BMT/NOPB involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the connectors. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The DS90CF363BMT/NOPB requires a single 3.3V power supply. It's recommended to use a low-dropout linear regulator or a switching regulator with a low output voltage ripple to power the device. The power sequencing requirement is to power up the VCC pin before the input signals.
  • The maximum cable length supported by the DS90CF363BMT/NOPB depends on the type of cable and the frequency of operation. As a general guideline, the device can support cable lengths of up to 10 meters at 1 Gbps and up to 5 meters at 3 Gbps using a 24 AWG coaxial cable.
  • To troubleshoot issues with the DS90CF363BMT/NOPB, first check the power supply voltage and ensure it's within the recommended range. Then, verify that the input signals are correct and within the specified amplitude and frequency range. Use an oscilloscope to check the output signals and verify that they meet the expected specifications. If the issue persists, check the PCB layout and ensure that it meets the recommended layout guidelines.
  • The DS90CF363BMT/NOPB has a maximum junction temperature of 150°C. To ensure reliable operation, it's recommended to keep the device temperature below 125°C. A thermal management strategy can include using a heat sink, thermal interface material, and ensuring good airflow around the device.

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DS90CF363BMT/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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