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DS90CF386MTD/NOPB - Texas Instruments

Description: +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link - 85 MHz

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DS90CF386MTD/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG0056A
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DS90CF386MTD/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGG0056A
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DS90CF386MTD/NOPB Details

  • Manufacturer Part Number:

    DS90CF386MTD/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Pin Count:

    56

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.000015 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -10 °C

  • Out Swing-Min:

    2.4 V

  • Output Low Current-Max:

    0.002 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    135 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

DS90CF386MTD/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane and a separate power plane for the device. The device should be placed near the center of the board, and the input and output traces should be routed away from each other to minimize crosstalk.
  • To ensure signal integrity, use controlled impedance traces, minimize trace lengths, and use termination resistors at the receiver end. Also, use a common mode filter or a ferrite bead to reduce electromagnetic interference (EMI).
  • The maximum cable length supported by the DS90CF386MTD/NOPB depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths up to 10 meters at a data rate of 3.125 Gbps.
  • To troubleshoot issues with the DS90CF386MTD/NOPB, use an oscilloscope to check the signal quality and amplitude at the input and output of the device. Also, check the power supply voltage and the termination resistors to ensure they are within the recommended specifications.
  • The DS90CF386MTD/NOPB is rated for operation up to 85°C. However, the device's performance may degrade at higher temperatures. If you need to operate the device in a high-temperature environment, consider using a heat sink or a thermal management system to keep the device within its recommended operating temperature range.

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DS90CF386MTD/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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