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DS90CF386MTDX/NOPB - Texas Instruments

Description: +3.3V LVDS Receiver 24-Bit Flat Panel Display (FPD) Link - 85 MHz

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DS90CF386MTDX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G56)
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DS90CF386MTDX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGG (R-PDSO-G56)
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DS90CF386MTDX/NOPB Details

  • Manufacturer Part Number:

    DS90CF386MTDX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP, TSSOP56,.3,20

  • Pin Count:

    56

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.000015 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -10 °C

  • Out Swing-Min:

    2.4 V

  • Output Low Current-Max:

    0.002 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    135 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

DS90CF386MTDX/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the DS90CF386MTDX/NOPB involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the connectors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • Proper termination for the DS90CF386MTDX/NOPB involves using a 100-ohm differential termination resistor at the receiver end, and a 50-ohm single-ended termination resistor at the transmitter end. Additionally, it's recommended to use a termination scheme that matches the impedance of the transmission line.
  • The maximum cable length supported by the DS90CF386MTDX/NOPB depends on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths of up to 10 meters at a data rate of 3.125 Gbps, and up to 5 meters at a data rate of 6.25 Gbps.
  • The DS90CF386MTDX/NOPB can be configured for a specific data rate and protocol using the device's control pins and registers. The specific configuration will depend on the application and the desired data rate and protocol. Refer to the device's datasheet and application notes for more information.
  • The DS90CF386MTDX/NOPB requires a specific power sequencing to ensure proper operation. The recommended power-up sequence is to apply the analog power supply (AVCC) first, followed by the digital power supply (DVCC), and finally the clock signal. The power-down sequence should be reversed.

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DS90CF386MTDX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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