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DS90CR217MTD - Texas Instruments

Description: LVDS Transceiver,DS90CR217MTD

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DS90CR217MTD - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G48)
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DS90CR217MTD - Texas Instruments  - 3D model - Small Outline Packages - DGG (R-PDSO-G48)
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DS90CR217MTD Details

  • Manufacturer Part Number:

    DS90CR217MTD

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-48

  • Pin Count:

    48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    SEATED HGT-NOM

  • Differential Output:

    YES

  • Driver Number of Bits:

    21

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e0

  • Length:

    12.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -10 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    57 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    6.1 mm

DS90CR217MTD Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DS90CR217MTD evaluation module documentation, which includes guidelines for component placement, routing, and thermal management. It's essential to follow these guidelines to ensure optimal performance and minimize signal integrity issues.
  • The DS90CR217MTD has several configuration options, including input equalization, output de-emphasis, and clocking modes. Texas Instruments provides a configuration tool, the DS90CR217MTD Evaluation Software, which allows engineers to configure the device for their specific application. The tool provides a graphical user interface to set registers and monitor device performance.
  • The maximum cable length supported by the DS90CR217MTD depends on the specific application and the type of cable used. In general, the device can support cable lengths up to 10 meters at 3.125 Gbps and 5 meters at 6.25 Gbps. However, the actual cable length may be limited by the signal integrity and the quality of the cable.
  • Texas Instruments provides a troubleshooting guide for the DS90CR217MTD, which includes a step-by-step approach to identifying and resolving common issues. Engineers can also use the device's built-in diagnostic features, such as the eye diagram and signal quality indicator, to help troubleshoot problems.
  • Yes, the DS90CR217MTD is compatible with other FPD-Link III devices from Texas Instruments. The device is designed to be backward compatible with previous generations of FPD-Link devices, and it can be used in conjunction with other FPD-Link III devices to create a complete system solution.

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DS90CR217MTD Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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