Part Image

DS96F173MJ/883 - Texas Instruments

Description: Bus Receivers EIA-485/EIA-422 Quad Differential Receivers 16-CDIP -55 to 125

Download DS96F173MJ/883 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
DS96F173MJ/883 - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - NFE0016A
click to zoom
3D Models
DS96F173MJ/883 - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - NFE0016A
click to zoom

DS96F173MJ/883 Details

  • Manufacturer Part Number:

    DS96F173MJ/883

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    LG_MAX

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-422-A; EIA-423-A; EIA-485

  • JESD-30 Code:

    R-GDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.94 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Out Swing-Min:

    2.05 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.016 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    30 ns

  • Receiver Number of Bits:

    1

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    55 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

DS96F173MJ/883 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device's thermal pad should be connected to the ground plane using multiple thermal vias.
  • Ensure that the device is operated within the recommended temperature range (−40°C to 125°C). Use a heat sink or thermal interface material to reduce the junction temperature. Also, ensure that the device is properly soldered and the PCB is designed for good thermal conductivity.
  • Use a metal shield or a shielded enclosure to reduce EMI and RFI emissions. Ensure that the PCB is designed with good electromagnetic compatibility (EMC) practices, such as using a solid ground plane, minimizing signal loop areas, and using EMI filters.
  • The device requires a specific power sequencing to prevent latch-up. Ensure that the power supplies are sequenced in the correct order: VCC, then VDD, and finally VEE. Also, ensure that the power supplies are stable and within the recommended voltage ranges.
  • Use a reflow soldering process with a peak temperature of 260°C. Ensure that the PCB is designed with a solder mask and a solder resist to prevent solder bridging. Use a fluxless soldering process to prevent contamination.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

DS96F173MJ/883 Overview

Use the download button to access the DS96F173MJ/883 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like DS96F, or try a keyword search, such as Line Driver or Receivers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

Parts related to DS96F173MJ/883

Showing 0 results

DS96F173MJ/883 Alternates

Showing results

Image Part Number Model
Part Image 5962-9164001QEX Texas Instruments

Line Receiver, 4 Func, 4 Rcvr, BICMOS, CDIP16

Part Image 5962R9568901TEX Renesas Electronics Corporation

Line Receiver, 4 Func, 4 Rcvr, CMOS, CDIP16

Part Image DS26C32ATJ Texas Instruments

Line Receiver, 1 Func, 4 Rcvr, CMOS, CDIP16

Part Image AM26C32MJ Texas Instruments

Line Receiver, 4 Func, 4 Rcvr, BICMOS, CDIP16

Part Image AM26C32QN Texas Instruments

Line Receiver, 4 Func, 4 Rcvr, BICMOS, PDIP16

For a full list of alternate parts for DS96F173MJ/883, check out Findchips.com