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DS96F174MJ-QMLV - Texas Instruments

Description: RS-422/RS-485 Interface IC EIA-485/EIA-422 Quad Differential Drivers 16-CDIP -55 to 125

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DS96F174MJ-QMLV - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - NFE0016A
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DS96F174MJ-QMLV - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - NFE0016A
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DS96F174MJ-QMLV Details

  • Manufacturer Part Number:

    DS96F174MJ-QMLV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-CDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.94 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Out Swing-Min:

    1.2 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.000059999999999999995 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    50 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    25 ns

  • Width:

    7.62 mm

DS96F174MJ-QMLV Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the analog and digital signal traces separate. Additionally, it's recommended to use a decoupling capacitor (e.g. 0.1uF) between VCC and GND, and to keep the power supply lines as short as possible.
  • To ensure the DS96F174MJ-QMLV operates within its specified temperature range, it's recommended to provide adequate heat sinking, use a thermal interface material (e.g. thermal tape or thermal grease) between the device and the heat sink, and to avoid exposing the device to extreme temperatures during storage or operation.
  • Texas Instruments recommends using a 50-ohm termination resistor in series with the input signal, and a 50-ohm termination resistor in parallel with the output signal. Additionally, it's recommended to use a low-pass filter (e.g. RC filter) to filter out high-frequency noise.
  • To ensure proper operation, it's recommended to power up the device in the following sequence: VCC, then AVCC, then DVCC. When powering down, the sequence should be reversed. Additionally, it's recommended to use a power-on reset (POR) circuit to ensure the device is properly reset during power-up.
  • To protect the DS96F174MJ-QMLV from electrostatic discharge (ESD), it's recommended to use ESD protection devices (e.g. TVS diodes) on the input and output pins, and to handle the device by the body or use an ESD wrist strap when handling the device.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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