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DS96F175MJ-QMLV - Texas Instruments

Description: Bus Receivers EIA-485/EIA-422 Quad Differential Receivers 16-CDIP -55 to 125

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DS96F175MJ-QMLV - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - NFE0016A
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DS96F175MJ-QMLV - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - NFE0016A
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DS96F175MJ-QMLV Details

  • Manufacturer Part Number:

    DS96F175MJ-QMLV

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    LG_MAX

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-422-A; EIA-423-A; EIA-485

  • JESD-30 Code:

    R-GDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.94 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Out Swing-Min:

    2.05 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    30 ns

  • Receiver Number of Bits:

    4

  • Screening Level:

    MIL-PRF-38535 Class V

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    75 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

DS96F175MJ-QMLV Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the analog and digital sections separate. Additionally, it's recommended to use a decoupling capacitor (e.g., 0.1uF) between VCC and GND, and to keep the signal traces as short as possible.
  • To ensure the DS96F175MJ-QMLV operates within its specified temperature range, it's recommended to provide adequate heat sinking, use a thermal interface material (e.g., thermal tape or thermal grease), and ensure good airflow around the device. Additionally, consider using a thermistor or thermocouple to monitor the device temperature.
  • Texas Instruments recommends a power-up sequence of VCC first, followed by VDD, and then the input signals. For power-down, the sequence should be reversed. Additionally, it's recommended to use a power-on reset (POR) circuit to ensure the device resets properly during power-up.
  • During power-up and power-down, it's recommended to keep the analog and digital pins in a high-impedance state (e.g., using a pull-up or pull-down resistor) to prevent unwanted voltage levels. Additionally, consider using a voltage clamp or a Schottky diode to protect the pins from overvoltage conditions.
  • To protect the DS96F175MJ-QMLV from electrostatic discharge (ESD), it's recommended to use ESD protection devices (e.g., TVS diodes or ESD arrays) on the input and output pins. Additionally, consider using an ESD-protected socket or connector, and follow proper handling and storage procedures to prevent ESD damage.

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DS96F175MJ-QMLV Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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