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FDC3601N - onsemi

Description: 1.0 A, 100 V ; RDS(on) = 550 mΩ @ VGS = 6 V ; Fast switching speed ; SuperSOT™-6 package: small footprint 72%(smaller than standard SO-8); low profile (1mm thick) ; RDS(on) = 500 mΩ@ VGS = 10 V ; High performance trench technology for extremely low RDS(ON) ; Low gate charge (3.7nC typical)

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PCB Footprints
FDC3601N - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOT23 6−Lead CASE 419BL ISSUE A
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3D Models
FDC3601N - onsemi  - 3D model - SOT23 (6-Pin) - TSOT23 6−Lead CASE 419BL ISSUE A
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FDC3601N Details

  • Manufacturer Part Number:

    FDC3601N

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOT-23-6

  • Manufacturer Package Code:

    419BL

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6.9

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    1 A

  • Drain-source On Resistance-Max:

    0.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.7 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDC3601N Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDC3601N involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and placing it close to the device can help reduce EMI.
  • To ensure the FDC3601N operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Make sure the device is not exposed to excessive voltage, current, or temperature, and that the thermal design is adequate to keep the junction temperature below the maximum rating.
  • A low-ESR ceramic capacitor with a value of 4.7uF to 10uF is recommended for the input of the FDC3601N. This helps to filter out noise and ripple on the input voltage.
  • To troubleshoot issues with the FDC3601N, start by checking the input voltage, output voltage, and output current. Verify that the device is properly soldered and that the PCB layout is correct. Check for signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to check for noise or oscillations on the output.
  • Yes, the FDC3601N is suitable for high-reliability and automotive applications. It is AEC-Q100 qualified and meets the requirements for automotive and industrial applications. However, ensure that the device is used within its specified operating conditions and that the system design meets the required safety and reliability standards.

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FDC3601N Overview

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Part Image FDC3601ND84Z onsemi

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Part Image FDC3601N Rochester Electronics LLC

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Part Image FDC3601N Fairchild Semiconductor Corporation

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Part Image FDC3601NS62Z Fairchild Semiconductor Corporation

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Part Image FDC3601ND87Z Fairchild Semiconductor Corporation

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For a full list of alternate parts for FDC3601N, check out Findchips.com