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FDC610PZ - onsemi

Description: Max rDS(on) = 75mΩ at VGS = -4.5V, ID = -3.7A; Low gate charge (17nC typical).; High performance trench technology for extremely low rDS(on). ; SuperSOT™-6 package: small footprint (72% smaller than standard SO-8) low profile (1mm thick).; Max rDS(on) = 42mΩ at VGS = -10V, ID = -4.9A; RoHS compliant

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PCB Footprints
FDC610PZ - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOT23 6−Lead CASE 419BL
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3D Models
FDC610PZ - onsemi  - 3D model - SOT23 (6-Pin) - TSOT23 6−Lead CASE 419BL
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FDC610PZ Details

  • Manufacturer Part Number:

    FDC610PZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    SUPERSOT-6

  • Manufacturer Package Code:

    419BL

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.07

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    0.0049 A

  • Drain-source On Resistance-Max:

    0.042 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    190 pF

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation Ambient-Max:

    1.6 W

  • Power Dissipation-Max (Abs):

    1.6 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDC610PZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDC610PZ involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, using a 4-layer PCB with a dedicated power plane and a dedicated ground plane can help reduce noise and improve performance.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves applying a known pressure and adjusting the offset and gain registers accordingly. It's also important to ensure the device is at a stable temperature and that the pressure sensor is properly sealed and connected.
  • The recommended power-up sequence for the FDC610PZ is to first apply the analog power supply (VDDA), followed by the digital power supply (VDDD), and then the clock signal. This ensures that the analog circuitry is powered up before the digital circuitry, preventing any potential damage or incorrect operation.
  • To handle the FDC610PZ's digital output data, use a microcontroller or DSP to read the 24-bit pressure data and 8-bit temperature data from the device. Ensure that the data is read at a rate that is at least 10 times faster than the device's output data rate to prevent data loss or corruption.
  • To ensure the FDC610PZ's long-term reliability and stability, consider factors such as operating temperature range, humidity, and vibration. Ensure that the device is operated within its recommended specifications, and that it is properly sealed and protected from environmental factors. Regular calibration and maintenance can also help ensure long-term reliability and stability.

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FDC610PZ Overview

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