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FDC6331L - onsemi

Description: RDS(ON) = 100 mΩ @ VGS = –1.8 V; RDS(ON) = 70 mΩ @ VGS = –2.5 V; –2.8 A, –8 V. ; High performance trench technology for extremelylow RDS(ON); Control MOSFET (Q1) includes Zener protection forESD ruggedness (>6KV Human body model); RDS(ON) = 55 mΩ @ VGS = –4.5 V

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Symbol
FDC6331L - onsemi - PCB symbol
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PCB Footprints
FDC6331L - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOT23 6−Lead CASE 419BL ISSUE O
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3D Models
FDC6331L - onsemi - 3D model - SOT23 (6-Pin) - TSOT23 6−Lead CASE 419BL ISSUE O
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FDC6331L Details

  • Manufacturer Part Number:

    FDC6331L

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    TSOT-23, 6 PIN

  • Manufacturer Package Code:

    419BL

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    6.98

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.95 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    8 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    6.4 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

FDC6331L Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDC6331L involves keeping the high-current paths short and wide, using a solid ground plane, and placing the device close to the load. Additionally, it's recommended to use a shielded cable for the output and to keep the input and output traces separate.
  • To ensure proper thermal management, it's recommended to attach a heat sink to the device, use a thermal interface material, and ensure good airflow around the device. The maximum junction temperature (TJ) should not exceed 150°C.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for the input capacitor. The capacitor should be placed close to the device and have a voltage rating of at least 25V.
  • To protect the FDC6331L from overvoltage and undervoltage conditions, it's recommended to use a voltage supervisor or a voltage monitor IC to detect and respond to voltage faults. Additionally, a TVS diode can be used to protect against voltage transients.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for the output capacitor. The capacitor should be placed close to the load and have a voltage rating of at least 10V.

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FDC6331L Overview

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