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FDC640P - onsemi

Description: RDS(ON) = 0.080 Ω @ VGS = -2.5 V ; RDS(ON) = 0.053 Ω @ VGS = -4.5 V ; Rugged gate rating ( ±12V) ; Fast switching speed ; High performance trench technology for extremelylow RDS(ON) ; -4.5 A, -20 V.

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PCB Footprints
FDC640P - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SuperSOT-6
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3D Models
FDC640P - onsemi  - 3D model - SOT23 (6-Pin) - SuperSOT-6
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FDC640P Details

  • Manufacturer Part Number:

    FDC640P

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    SUPERSOT-6

  • Manufacturer Package Code:

    419BL

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    4.5 A

  • Drain-source On Resistance-Max:

    0.053 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.6 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDC640P Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDC640P involves keeping the input and output traces separate, using a solid ground plane, and minimizing the length of the traces. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper biasing, make sure to connect the VCC pin to a stable 5V power supply, and the GND pin to a solid ground plane. Also, ensure that the input voltage is within the recommended range of 0.5V to 4.5V.
  • The FDC640P can operate up to 100 MHz, but the maximum frequency of operation depends on the specific application and the quality of the PCB layout. It's recommended to consult the datasheet and application notes for more information.
  • The FDC640P has a maximum junction temperature of 150°C. To ensure proper thermal management, make sure to provide adequate heat sinking, use a thermal pad or heat sink, and ensure good airflow around the device.
  • The recommended input impedance for the FDC640P is 50 ohms. This ensures optimal signal integrity and minimizes signal reflections.

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FDC640P Overview

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Part Image FDC640P Rochester Electronics LLC

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For a full list of alternate parts for FDC640P, check out Findchips.com