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FDMA1023PZ - onsemi

Description: Free from halogenated compounds and antimonyoxides ; HBM ESD protection level > 2kV typical ; Max rDS(on) = 95mΩ at VGS = –2.5V, ID = –3.2A ; Max rDS(on) = 72mΩ at VGS = –4.5V, ID = –3.7A ; RoHS Compliant ; Max rDS(on) = 130mΩ at VGS = –1.8V, ID = –2.0A ; Max rDS(on) = 195mΩ at VGS = –1.5V, ID = –1.0A ; Low profile - 0.8 mm maximum - in the new packageMicroFET 2x2 mm

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FDMA1023PZ - onsemi - PCB symbol
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PCB Footprints
FDMA1023PZ - onsemi PCB footprint - Other - Other - WDFN-6_2023
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3D Models
FDMA1023PZ - onsemi - 3D model - Other - WDFN-6_2023
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FDMA1023PZ Details

  • Manufacturer Part Number:

    FDMA1023PZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-6

  • Package Description:

    MICROFET-6

  • Manufacturer Package Code:

    511DA

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3.7 A

  • Drain-source On Resistance-Max:

    0.072 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    135 pF

  • JEDEC-95 Code:

    MO-229VCCC

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMA1023PZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDMA1023PZ involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the power supply decoupling capacitors. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper biasing, make sure to connect the VCC pin to a stable 3.3V or 5V power supply, and the GND pin to a solid ground plane. Also, ensure that the input signals are within the recommended voltage range (0.8V to 2.2V) and that the output is properly terminated with a 50Ω load.
  • The FDMA1023PZ is specified to operate up to 100 MHz, but it can be pushed to higher frequencies with proper PCB layout and signal conditioning. However, it's essential to ensure that the device is properly biased and that the input and output signals are within the recommended voltage range.
  • The FDMA1023PZ has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • The FDMA1023PZ has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking, such as a thermal pad or a heat sink, and to ensure good airflow around the device.

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FDMA1023PZ Overview

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FDMA1023PZ Alternates

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Part Image FDMA1023PZ Fairchild Semiconductor Corporation

Small Signal Field-Effect Transistor, 3.7A I(D), 20V, 2-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, MO-229VCCC