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FDMA86108LZ - onsemi

Description: Max rDS(on) = 243 mΩ at VGS = 10 V, ID = 2.2 A ; RoHS Compliant ; Max rDS(on) = 366 mΩ at VGS = 4.5 V, ID = 1.8 A ; Low Profile - 0.8 mm Maximum in the New Package MicroFET 2x2 mm ; Free from Halogenated Compounds and Antimony Oxides

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PCB Footprints
FDMA86108LZ - onsemi PCB footprint - Other - Other - MicroFET 2X2_2022
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FDMA86108LZ - onsemi  - 3D model - Other - MicroFET 2X2_2022
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FDMA86108LZ Details

  • Manufacturer Part Number:

    FDMA86108LZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-6

  • Manufacturer Package Code:

    511CZ

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.9

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    2.2 A

  • Drain-source On Resistance-Max:

    0.243 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.4 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMA86108LZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • The maximum allowable voltage on the input pins is 5.5V, which is the absolute maximum rating. Operating the device above this voltage can cause permanent damage.
  • Yes, the FDMA86108LZ can be used in switching regulator applications. However, ensure that the device is properly bypassed and decoupled to minimize noise and voltage transients.
  • Use proper PCB layout techniques, such as separating analog and digital grounds, using shielding, and minimizing loop areas. Also, consider using EMI filters or common-mode chokes to reduce emissions.

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FDMA86108LZ Overview

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