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FDMA86251 - onsemi

Description: Free from halogenated compounds and antimony oxides ; Max rDS(on) = 170 mΩ at VGS = 10 V, ID = 2.4 A ; RoHS Compliant ; Max rDS(on) = 237 mΩ at VGS = 6 V, ID = 2.0 A ; Low Profile - 0.8 mm maximum in the new package MicroFET 2x2 mm

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PCB Footprints
FDMA86251 - onsemi PCB footprint - Other - Other - WDFN6 2x2, 0.65P CASE 511DB ISSUE O
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FDMA86251 Details

  • Manufacturer Part Number:

    FDMA86251

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-6

  • Manufacturer Package Code:

    511DB

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.9

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    2.4 A

  • Drain-source On Resistance-Max:

    0.175 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    2.4 pF

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.4 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMA86251 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDMA86251 involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the antenna. Additionally, using a common mode filter and a shielded enclosure can help reduce EMI.
  • To optimize the performance of the FDMA86251 in a high-temperature environment, ensure good thermal management by providing adequate heat sinking and airflow. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • The maximum power handling capability of the FDMA86251 is 2W. Exceeding this power limit can cause permanent damage to the device.
  • While the FDMA86251 is designed for 50 ohm systems, it can be used in non-50 ohm systems with proper impedance matching. However, this may require additional circuitry and may affect the device's performance.
  • To troubleshoot issues with the FDMA86251, start by checking the power supply voltage, input/output impedance matching, and PCB layout. Use a spectrum analyzer to check for spurious emissions and a signal generator to test the device's frequency response.

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FDMA86251 Overview

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