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FDMA86265P - onsemi

Description: Max rDS(on) = 1.2 Ω at VGS = -10 V, ID = -1 A; This product is optimised for fast switching applications as well as load switch applications; Low Profile - 0.8 mm maximum in the new package MicroFET 2x2 mm; RoHS Compliant; 100% UIL tested; Very low RDS-on mid voltage P-channel silicon technology optimised for low Qg; Max rDS(on) = 1.4 Ω at VGS = -6 V, ID = -0.9 A

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PCB Footprints
FDMA86265P - onsemi PCB footprint - Other - Other - WDFN6 2x2, 0.65P CASE 511CZ ISSUE O_FFW
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3D Models
FDMA86265P - onsemi  - 3D model - Other - WDFN6 2x2, 0.65P CASE 511CZ ISSUE O_FFW
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FDMA86265P Details

  • Manufacturer Part Number:

    FDMA86265P

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-6

  • Package Description:

    MICROFET-6

  • Manufacturer Package Code:

    511CZ

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.5

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    1 A

  • Drain-source On Resistance-Max:

    1.2 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    2.4 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMA86265P Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, ensure proper PCB design, and follow the recommended operating conditions. Also, consider using a thermistor or thermocouple for temperature monitoring.
  • Use a shielded enclosure, ensure proper grounding, and follow best practices for PCB layout and component placement. Also, consider adding EMI filters or ferrite beads to the design.
  • Implement power-saving modes, optimize the clock frequency, and minimize unnecessary circuitry. Also, consider using a low-dropout regulator (LDO) for power supply.
  • Use a 4-wire Kelvin connection for accurate voltage measurements. Ensure proper probe placement and consider using a high-impedance probe for sensitive measurements.

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FDMA86265P Overview

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