Description:Low Profile - 0.8 mm maximum - in the new package MicroFET 2x3 mm ; Max rS1S2(on) = 21 mΩ at VGS = 3.1 V, ID = 7 A ; Max rS1S2(on) = 16.5 mΩ at VGS = 4.5 V, ID = 8 A ; HBM ESD protection level> 2 kV (Note 3) ; Max rS1S2(on) = 24 mΩ at VGS = 2.5 V, ID = 6.7 A ; RoHS Compliant ; Max rS1S2(on) = 18 mΩat VGS = 4.2 V, ID = 7.4 A
3 X 2 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MLP, 6 PIN
Manufacturer Package Code:
511CX
Country Of Origin:
Thailand
ECCN Code:
EAR99
Factory Lead Time:
111 Weeks
Manufacturer:
onsemi
YTEOL:
0
Case Connection:
DRAIN
Configuration:
COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE
Drain Current-Max (ID):
9.7 A
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
320 pF
JESD-30 Code:
R-PDSO-N6
JESD-609 Code:
e4
Moisture Sensitivity Level:
1
Number of Elements:
2
Number of Terminals:
6
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
2.2 W
Surface Mount:
YES
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
NO LEAD
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
FDMB2307NZ Frequently Asked Questions (FAQs)
A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. The datasheet provides a recommended PCB layout, but it's essential to consult with a thermal expert or perform thermal simulations to ensure optimal performance.
The FDMB2307NZ requires a specific biasing scheme to operate within its recommended operating conditions. Ensure that the input voltage is within the recommended range (typically 12V to 15V), and the output voltage is set to the desired level using the feedback resistors. Consult the datasheet for the recommended biasing circuit and component values.
When selecting external components, consider the input and output capacitors, feedback resistors, and inductor values. Ensure that these components meet the recommended specifications and are suitable for the desired operating frequency and output power. Consult the datasheet for recommended component values and consider simulation tools to optimize the design.
To troubleshoot common issues, start by verifying the PCB layout, component values, and biasing scheme. Check for proper decoupling, and ensure that the input and output capacitors are suitable for the operating frequency. Use oscilloscopes and simulation tools to analyze the circuit behavior and identify the root cause of the issue. Consult the datasheet and application notes for troubleshooting guidelines.
The FDMB2307NZ has a maximum junction temperature of 150°C. Ensure that the device is mounted on a heat sink or a thermally conductive PCB material, and that the thermal interface material is suitable for the application. Consider the thermal resistance of the device, PCB, and heat sink to ensure that the junction temperature remains within the recommended range.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
FDMB2307NZ Overview
Use the download button to access the FDMB2307NZ schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like FDMB2,
or try a keyword search, such as Small Signal Field-Effect Transistors
