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FDMC8200 - onsemi

Description: Q1: N-Channel Max. RDS(on) = 20 mΩ at VGS = 10 V, ID = 6A Max. RDS(on) = 32 mΩ at VGS = 4.5 V, ID = 5A ; Q2: N-Channel Max. RDS(on) = 9.5 mΩ at VGS = 10 V, ID = 9A Max. RDS(on) = 13.5 mΩ at VGS = 4.5 V, ID = 7A ; RoHS Compliant

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PCB Footprints
FDMC8200 - onsemi PCB footprint - Other - Other - FDMC8200-3
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3D Models
FDMC8200 - onsemi  - 3D model - Other - FDMC8200-3
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FDMC8200 Details

  • Manufacturer Part Number:

    FDMC8200

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-8

  • Package Description:

    3 X 3 MM, ROHS COMPLIANT, MLP, 8 PIN

  • Manufacturer Package Code:

    511DE

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7.07

  • Case Connection:

    DRAIN SOURCE

  • Configuration:

    SERIES, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    8 A

  • Drain-source On Resistance-Max:

    0.02 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    30 pF

  • JESD-30 Code:

    S-PDSO-N8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.9 W

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    66 ns

  • Turn-on Time-Max (ton):

    30 ns

FDMC8200 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDMC8200 involves keeping the input and output stages separate, using a star-ground configuration, and minimizing the length of the traces to reduce EMI and noise.
  • To optimize the FDMC8200 for low power consumption, use the lowest possible supply voltage, reduce the switching frequency, and use the built-in power-saving features such as the low-power mode and the shutdown pin.
  • The maximum allowed voltage on the input pins of the FDMC8200 is 5.5V, exceeding which may cause damage to the device.
  • To ensure EMC with the FDMC8200, use a metal shield around the device, keep the PCB layout compact, and use EMI filters on the input and output lines.
  • The recommended operating temperature range for the FDMC8200 is -40°C to 125°C, and the device is not guaranteed to function outside this range.

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FDMC8200 Overview

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