SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
80 V
Drain Current-Max (ID):
11 A
Drain-source On Resistance-Max:
0.0082 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
25 pF
JESD-30 Code:
R-PDSO-N12
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
2
Number of Terminals:
12
Operating Mode:
ENHANCEMENT MODE
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Surface Mount:
YES
Terminal Finish:
MATTE TIN
Terminal Form:
NO LEAD
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
FDMD8280 Frequently Asked Questions (FAQs)
A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize crosstalk.
The FDMD8280 requires a bias voltage of 3.3V or 5V. Ensure the bias voltage is stable and noise-free, and that the input and output pins are properly terminated to prevent oscillations.
The FDMD8280 can operate up to 2.7 GHz, but the maximum frequency may vary depending on the specific application and PCB layout. Consult the datasheet and application notes for more information.
The FDMD8280 has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Monitor the device temperature and adjust the thermal management strategy accordingly.
The FDMD8280 has internal ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure the device is properly grounded during handling.
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FDMD8280 Overview
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