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FDMQ8205A - onsemi

Description: Eliminating Thermal Design Problems ; Self Driving Circuitry for MOSFETs ; Low Power Loss GreenBridgeTM Replaces Diode Bridge ; Low rDS(on) 100V Rated MOSFETs ; Maximizing Available Power and Voltage ; Compact MLP 4.5x5 Package ; IEEE802.3at Compatible Meet Detection and Classification Requirement Work with 2 and 4-pair Architecture Small Backfeed Voltage

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FDMQ8205A - onsemi - PCB symbol
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PCB Footprints
FDMQ8205A - onsemi PCB footprint - Other - Other - WDFN12 5x4.5, 0.8P CASE 511CS ISSUE O
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3D Models
FDMQ8205A - onsemi - 3D model - Other - WDFN12 5x4.5, 0.8P CASE 511CS ISSUE O
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FDMQ8205A Details

  • Manufacturer Part Number:

    FDMQ8205A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-12

  • Manufacturer Package Code:

    511CS

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Configuration:

    COMPLEX

  • Drain Current-Max (ID):

    1.7 A

  • Drain-source On Resistance-Max:

    0.051 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-N12

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    4

  • Number of Terminals:

    12

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDMQ8205A Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended PCB layout guidelines. Also, consider using a thermal monitoring system to prevent overheating.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, it's recommended to keep the input voltage below 5V to ensure reliable operation.
  • Yes, the FDMQ8205A is suitable for high-frequency switching applications up to 100 kHz. However, ensure that the PCB layout is optimized for high-frequency operation, and consider using a snubber circuit to reduce electromagnetic interference (EMI).
  • Use ESD protection devices such as TVS diodes or ESD suppressors on the input and output pins. Also, follow proper handling and storage procedures to prevent ESD damage.

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FDMQ8205A Overview

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