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FDN86246 - onsemi

Description: High Performance Trench Technology for Extremely Low rDS(on); Max rDS(on) = 359 mΩ at VGS = 6 V, ID = 1.4 A ; RoHS Compliant ; 100% UIL Tested; Fast Switching Speed; High Power and Current Handling Capability in a Widely Used Surface Mount Package; Max rDS(on) = 261 mΩ at VGS = 10 V, ID = 1.6 A

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PCB Footprints
FDN86246 - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - sot-23-1-ren1
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3D Models
FDN86246 - onsemi  - 3D model - SOT23 (3-Pin) - sot-23-1-ren1
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FDN86246 Details

  • Manufacturer Part Number:

    FDN86246

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23-3

  • Package Description:

    ROHS COMPLIANT, SUPERSOT-3

  • Manufacturer Package Code:

    527AG

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.9

  • Additional Feature:

    ULTRA-LOW RESISTANCE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    1.6 A

  • Drain-source On Resistance-Max:

    0.261 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDN86246 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure the input voltage is within the recommended range (4.5V to 5.5V). Use a stable voltage regulator and decoupling capacitors to minimize noise and ripple.
  • The FDN86246 can handle up to 2A continuous current. However, it's recommended to derate the current based on the ambient temperature and PCB thermal design.
  • Use a TVS diode or a zener diode to clamp the input voltage. Add a current-sensing resistor and a fuse or a PTC resettable fuse to protect against overcurrent conditions.
  • Use a TVS diode or a dedicated ESD protection IC, such as the NUP4301, to protect the device from electrostatic discharge.

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Manufacturer Collaborated
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FDN86246 Overview

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