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FDS3590 - onsemi

Description: Fast switching speed ; High performance trench technology for extremelylow RDS(ON) ; RDS(on) = 39 mΩ @ VGS = 10 V ; Low gate charge ; 6.5 A, 80 V ; RDS(on) = 44 mΩ @ VGS = 6 V ; High power and current handling capability

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FDS3590 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin SOIC_ISSUE A
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FDS3590 - onsemi  - 3D model - Small Outline Packages - 8-Pin SOIC_ISSUE A
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FDS3590 Details

  • Manufacturer Part Number:

    FDS3590

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.07

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    6.5 A

  • Drain-source On Resistance-Max:

    0.037 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS3590 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the device away from heat sources and ensure good airflow.
  • Use a heat sink, ensure good thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage and current ratings. For the FDS3590, the SOA is limited by the maximum voltage (40V) and current (10A) ratings. Operating within these limits ensures safe and reliable operation.
  • Use a transient voltage suppressor (TVS) or a zener diode to clamp voltage transients. Also, ensure proper PCB layout and routing to minimize electromagnetic interference (EMI).
  • A gate drive circuit with a low impedance output, such as a dedicated gate driver IC or a totem pole configuration, is recommended. This ensures fast switching times and minimizes electromagnetic interference (EMI).

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FDS3590 Overview

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