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FDS8638 - onsemi

Description: High performance trench technology for extremely low rDS(on); RoHS Compliant; Max rDS(on) = 4.3 mΩ at VGS = 10 V, ID = 18 A; 100% UIL Tested; Max rDS(on) = 5.4 mΩ at VGS = 4.5 V, ID = 16 A

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PCB Footprints
FDS8638 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SO-8_2024
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FDS8638 - onsemi  - 3D model - Small Outline Packages - SO-8_2024
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FDS8638 Details

  • Manufacturer Part Number:

    FDS8638

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.2

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    18 A

  • Drain-source On Resistance-Max:

    0.0043 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    180 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS8638 Frequently Asked Questions (FAQs)

  • The maximum current rating of the FDS8638 is 3.5A per channel, but it's recommended to derate the current to 2.5A per channel for reliable operation.
  • To ensure proper thermal management, it's recommended to attach a heat sink to the device, and ensure good airflow around the device. The thermal pad on the bottom of the package should be connected to a copper plane on the PCB to help dissipate heat.
  • The recommended PCB layout for the FDS8638 involves keeping the high-current paths short and wide, using multiple vias to connect the thermal pad to a copper plane, and keeping the switching nodes away from sensitive analog circuits.
  • To optimize the FDS8638 for low power consumption, it's recommended to use a low-dropout linear regulator for the VCC supply, minimize the switching frequency, and use a low-power mode when the device is not in use.
  • When using the FDS8638, it's essential to consider EMI and EMC by using a shielded layout, minimizing loop areas, and using a common-mode choke to reduce emissions. Additionally, ensure that the device is properly decoupled and that the PCB layout is optimized for low radiation.

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FDS8638 Overview

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