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FDS86540 - onsemi

Description: RoHS Compliant ; Max rDS(on) = 4.5 mΩ at VGS = 10 V, ID = 18 A ; High performance trench technologh for extremely low rDS(on) ; 100% UIL Tested ; High power and current handing capability in a widely used surface mount package ; Max rDS(on) = 5.4 mΩ at VGS = 8 V, ID = 16.5 A

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FDS86540 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SO 8L NB (3) (SOIC)
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FDS86540 - onsemi  - 3D model - Small Outline Packages - SO 8L NB (3) (SOIC)
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FDS86540 Details

  • Manufacturer Part Number:

    FDS86540

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7.2

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    18 A

  • Drain-source On Resistance-Max:

    0.0045 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    130 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    5 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS86540 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure the input voltage (VIN) is within the recommended range (4.5V to 18V). Use a stable voltage regulator and decoupling capacitors to minimize noise and ripple.
  • The maximum allowed current is 3.5A. Exceeding this limit may cause the device to overheat or fail.
  • Use a voltage supervisor or a voltage monitor IC to detect and respond to overvoltage and undervoltage conditions. Add TVS diodes or zener diodes for overvoltage protection.
  • Use a TVS diode or a transient voltage suppressor (TVS) array to protect the device from electrostatic discharge (ESD) events.

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FDS86540 Overview

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