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FDS89161 - onsemi

Description: Max rDS(on) = 171 mΩ at VGS = 6 V, ID = 2.1 A ; 100% UIL Tested ; Shielded Gate MOSFET Technology ; RoHS Compliant ; Max rDS(on) = 105 mΩat VGS= 10 V, ID = 2.7 A ; High power and current handling capability in a widely used surface mount package ; High performance trench technology for extremely low rDS(on)

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FDS89161 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8 CASE 751EB ISSUE A
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FDS89161 - onsemi  - 3D model - Small Outline Packages - SOIC8 CASE 751EB ISSUE A
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FDS89161 Details

  • Manufacturer Part Number:

    FDS89161

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.9

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    2.7 A

  • Drain-source On Resistance-Max:

    0.105 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    3.1 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS89161 Frequently Asked Questions (FAQs)

  • The FDS89161 can operate from -40°C to 150°C, making it suitable for automotive and industrial applications.
  • To ensure proper biasing, connect the VCC pin to a stable 5V power supply, and the EN pin to a logic-level input (e.g., 3.3V or 5V) to enable the device. Additionally, decouple the VCC pin with a 10nF capacitor to reduce noise.
  • To minimize EMI and thermal issues, use a 4-layer PCB with a solid ground plane, and place the FDS89161 near the power source. Keep the input and output traces short and away from each other, and use a thermal pad or heat sink to dissipate heat.
  • Use a voltage regulator or a transient voltage suppressor (TVS) to protect the FDS89161 from overvoltage conditions. For overcurrent protection, add a fuse or a current-limiting resistor in series with the output pin.
  • For optimal performance, use a 10nF to 100nF input capacitor (Cin) and a 10nF to 100nF output capacitor (Cout) to filter out noise and reduce ringing.

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