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FDS8958A_F085 - onsemi

Description: Fairchild FDS8958A_F085 Dual N/P-channel MOSFET Transistor, 8-Pin SOIC

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FDS8958A_F085 - onsemi - PCB symbol
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FDS8958A_F085 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8 CASE751EB
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FDS8958A_F085 - onsemi - 3D model - Small Outline Packages - SOIC8 CASE751EB
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FDS8958A_F085 Details

  • Manufacturer Part Number:

    FDS8958A_F085

  • Brand Name:

    ON Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SMALL OUTLINE, R-PDSO-G8

  • Manufacturer Package Code:

    M08A

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    54 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    7 A

  • Drain-source On Resistance-Max:

    0.028 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS8958A_F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. It's also recommended to use a thermal pad on the bottom of the device.
  • The device requires a bias voltage of 5V to 15V, and the recommended bias current is 1mA to 10mA. Ensure the bias voltage is stable and noise-free, and use a suitable resistor value to set the bias current.
  • The maximum allowable power dissipation for the FDS8958A-F085 is 1.5W. Ensure the device is properly heat-sinked and the ambient temperature is within the recommended operating range to prevent overheating.
  • Use an ESD wrist strap or mat when handling the device, and ensure the PCB has ESD protection circuits such as TVS diodes or ESD protection arrays. Also, handle the device by the body or pins, not the leads.
  • Store the device in a dry, cool place away from direct sunlight. Avoid exposing the device to moisture, extreme temperatures, or physical stress. Handle the device with clean, dry gloves or a vacuum pick-up tool.

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FDS8958A_F085 Overview

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