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FDT86102LZ - onsemi

Description: N-Channel PowerTrench® MOSFET 100V, 6.6A, 28mΩ

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FDT86102LZ - onsemi PCB footprint - Other - Other - FDT86102LZ-2
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FDT86102LZ - onsemi  - 3D model - Other - FDT86102LZ-2
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FDT86102LZ Details

  • Manufacturer Part Number:

    FDT86102LZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223-4 / TO-261-4

  • Package Description:

    ROHS COMPLIANT PACKAGE-4

  • Manufacturer Package Code:

    318H-01

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7.07

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    6.6 A

  • Drain-source On Resistance-Max:

    0.028 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    15 pF

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDT86102LZ Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FDT86102LZ is -40°C to 150°C.
  • To ensure proper biasing, connect VCC to a 5V power supply, and connect VEE to a -5V power supply or ground, depending on the application. Also, ensure that the input voltage is within the recommended range of 4.5V to 5.5V.
  • For optimal thermal management, use a multi-layer PCB with a solid ground plane and thermal vias to dissipate heat. Keep the device away from heat sources and ensure good airflow. Use a thermal pad or heat sink if necessary.
  • Handle the FDT86102LZ with ESD-protective equipment, such as wrist straps or mats, to prevent damage from electrostatic discharge. Avoid touching the device's pins or handling it in environments with high electrostatic potential.
  • Use a soldering iron with a temperature range of 250°C to 260°C, and a soldering time of 3-5 seconds. Avoid applying excessive heat or force, which can damage the device.

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FDT86102LZ Overview

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