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FDT86113LZ - onsemi

Description: RoHS Compliant; 100% UIL tested; Max rDS(on) = 145 mΩ at VGS = 4.5 V, ID = 2.7 A; HBM ESD protection level > 3 KV typical (Note 4); High power and current handling capability in a widely usedsurface mount package; Max rDS(on) = 100 mΩ at VGS = 10 V, ID = 3.3 A; High performance trench technology for extremely low rDS(on)

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Symbol
FDT86113LZ - onsemi - PCB symbol
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PCB Footprints
FDT86113LZ - onsemi PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT−223 CASE 318H
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3D Models
FDT86113LZ - onsemi - 3D model - SOT223 (3-Pin) - SOT−223 CASE 318H
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FDT86113LZ Details

  • Manufacturer Part Number:

    FDT86113LZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223-4 / TO-261-4

  • Manufacturer Package Code:

    318H-01

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6

FDT86113LZ Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FDT86113LZ is -40°C to 150°C.
  • To ensure proper biasing, connect the VCC pin to a 5V power supply, and the VEE pin to a -5V power supply or ground, depending on the application.
  • To minimize EMI and noise, use a multi-layer PCB with a solid ground plane, and keep the input and output traces as short as possible. Also, use a common-mode choke or ferrite bead on the input lines.
  • Yes, the FDT86113LZ can be used in high-frequency applications up to 1 GHz, but it's essential to follow proper PCB layout and decoupling techniques to minimize parasitic inductance and capacitance.
  • To protect the FDT86113LZ from ESD, use an ESD protection device, such as a TVS diode or a zener diode, on the input lines, and follow proper handling and storage procedures.

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FDT86113LZ Overview

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