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FDT86244 - onsemi

Description: High performance trench technology for extremely low rDS(on); High power and current handling capability in a widely used surface mount package; Max rDS(on) = 128 mΩ at VGS = 10 V, ID = 2.8 A; 100% UIL Tested; Fast switching speed; Max rDS(on) = 178 mΩ at VGS = 6 V, ID = 2.4 A; RoHS Compliant

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PCB Footprints
FDT86244 - onsemi PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT−223 CASE 318H ISSUE B-1
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3D Models
FDT86244 - onsemi  - 3D model - SOT223 (3-Pin) - SOT−223 CASE 318H ISSUE B-1
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FDT86244 Details

  • Manufacturer Part Number:

    FDT86244

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223-4 / TO-261-4

  • Package Description:

    ROHS COMPLIANT PACKAGE-4

  • Manufacturer Package Code:

    318H-01

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.9

  • Additional Feature:

    ULTRA-LOW RESISTANCE

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    2.8 A

  • Drain-source On Resistance-Max:

    0.128 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDT86244 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDT86244 involves keeping the input and output traces separate, using a solid ground plane, and minimizing the length of the traces to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and the VEE pin to a stable voltage sink. The recommended bias voltage is between 2.7V and 5.5V. Also, ensure that the input voltage is within the recommended range of 0.5V to VCC-0.5V.
  • The FDT86244 can handle a maximum current of 100mA per channel. However, it's recommended to keep the current below 50mA per channel to ensure reliable operation and to prevent overheating.
  • To protect the FDT86244 from ESD and overvoltage, use TVS diodes or ESD protection devices on the input and output pins. Also, ensure that the PCB has adequate clearance and creepage distances to prevent electrical overstress.
  • The recommended operating temperature range for the FDT86244 is -40°C to 125°C. However, the device can operate up to 150°C with reduced performance and reliability.

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FDT86244 Overview

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