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FGB3040G2-F085C - onsemi

Description: SCIS Energy = 300mJ at TJ = 25°C; Logic Level Gate Drive; Qualified to AEC Q101; RoHS Compliant

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FGB3040G2-F085C - onsemi PCB footprint - Other - Other - FGB3040G2-F085C-1
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FGB3040G2-F085C - onsemi  - 3D model - Other - FGB3040G2-F085C-1
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FGB3040G2-F085C Details

  • Manufacturer Part Number:

    FGB3040G2-F085C

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK-3 / TO-263-2

  • Manufacturer Package Code:

    418AJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2019-01-30

  • Manufacturer:

    onsemi

  • YTEOL:

    5.4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    26.9 A

  • Collector-Emitter Voltage-Max:

    390 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • Fall Time-Max (tf):

    15000 ns

  • Gate-Emitter Thr Voltage-Max:

    2.2 V

  • Gate-Emitter Voltage-Max:

    10 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    166 W

  • Reference Standard:

    AEC-Q101

  • Rise Time-Max (tr):

    7000 ns

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    30000 ns

  • Turn-off Time-Nom (toff):

    7600 ns

  • Turn-on Time-Max (ton):

    11000 ns

  • Turn-on Time-Nom (ton):

    3000 ns

  • VCEsat-Max:

    1.75 V

FGB3040G2-F085C Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and placing thermal vias under the device to dissipate heat efficiently. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, ensure proper thermal design, including a heat sink if necessary, and avoid overheating during soldering or rework.
  • The FGB3040G2-F085C has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures when handling the device. This includes using an ESD wrist strap or mat, and storing the device in an ESD-protected package.
  • The FGB3040G2-F085C is rated for operation in a humidity range of 40% to 80% RH. However, it is recommended to follow proper moisture sensitivity level (MSL) handling procedures to prevent damage during assembly and storage.
  • The recommended soldering profile for the FGB3040G2-F085C involves a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It is essential to follow the recommended soldering profile to prevent damage to the device.

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