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FGH75T65SQDNL4 - onsemi

Description: TJmax = 175°C; Improved Gate Control Lowers Switching Losses; Separate Emitter Drive Pin; TO-247-4L for Minimal Eon Losses; Optimized for High Speed Switching; These are Pb-Free Devices; Extremely Efficient Trench with Field Stop Technology

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FGH75T65SQDNL4 - onsemi PCB footprint - Other - Other - TO−247−4LD CASE 340CJ ISSUE O
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FGH75T65SQDNL4 - onsemi  - 3D model - Other - TO−247−4LD CASE 340CJ ISSUE O
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FGH75T65SQDNL4 Details

  • Manufacturer Part Number:

    FGH75T65SQDNL4

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247-4

  • Manufacturer Package Code:

    340CJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2019-01-10

  • Manufacturer:

    onsemi

  • YTEOL:

    5.35

  • Collector Current-Max (IC):

    150 A

  • Collector-Emitter Voltage-Max:

    650 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    5.6 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T4

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    375 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    467 ns

  • Turn-on Time-Nom (ton):

    113 ns

  • VCEsat-Max:

    2.1 V

FGH75T65SQDNL4 Frequently Asked Questions (FAQs)

  • The recommended gate resistor value is typically between 10Ω to 100Ω, depending on the specific application and switching frequency. A higher value can reduce EMI, but may slow down the switching speed.
  • Proper cooling can be achieved by using a heat sink with a thermal resistance of 1°C/W or lower, and applying a thermal interface material (TIM) with a thermal conductivity of 5 W/m-K or higher. Ensure the heat sink is properly mounted and the IGBT is securely fastened.
  • The maximum allowed voltage imbalance is typically ±10% of the rated voltage (650V). Exceeding this limit can lead to reduced reliability and potential failure.
  • Yes, the FGH75T65SQDNL4 can be used in resonant converter topologies, but ensure the design takes into account the IGBT's switching characteristics, and the resonant frequency is within the recommended range (typically 100 kHz to 500 kHz).
  • Implement overcurrent protection using a current sense resistor and a comparator or a dedicated overcurrent protection IC. For overvoltage protection, use a voltage clamp or a transient voltage suppressor (TVS) diode rated for the maximum voltage and power rating.

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