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FODM611R2 - onsemi

Description: High Noise Immunity characterized by common mode transient immunity (CMTi) - 20kV/µs Minimum CMTi; High Speed – 10Mbit/sec Date Rate (NRZ) – 100ns max. Propagation Delay – 35ns max. Pulse Width Distortion– 40ns max. Propagation Delay Skew; -40 to +85°C temperature range; Safety and regulatory approvals – UL1577, 3750 VACRMS for 1 min.– IEC60747-5-2 (pending approval)

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FODM611R2 - onsemi - PCB symbol
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PCB Footprints
FODM611R2 - onsemi PCB footprint - Other - Other - MFP5 4.1X4.4, 2.54P CASE 100AM ISSUE O_2023
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FODM611R2 Details

  • Manufacturer Part Number:

    FODM611R2

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MFP-5

  • Package Description:

    MINI-FLAT-5

  • Manufacturer Package Code:

    100AM

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    MICROPROCESSOR SYSTEM INTERFACE, UL APPROVED

  • Configuration:

    SINGLE

  • Data Rate-Nom:

    10 MBps

  • Forward Current-Max:

    0.05 A

  • Isolation Voltage-Max:

    3750 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Number of Functions:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    LOGIC IC OUTPUT OPTOCOUPLER

  • Packing Method:

    TR

  • Power Dissipation-Max:

    0.085 W

  • Response Time-Max:

    1e-7 s

  • Response Time-Nom:

    5e-8 ns

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FODM611R2 Frequently Asked Questions (FAQs)

  • A good PCB layout for FODM611R2 involves keeping the input and output traces separate, using a ground plane, and minimizing the length of the traces to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 5V power supply, and the GND pin to a solid ground plane. The input pins (VIN and VOUT) should be biased to the desired voltage level using a voltage divider or a dedicated voltage regulator.
  • The maximum allowable power dissipation for FODM611R2 is 1.4W. Exceeding this limit can cause the device to overheat, leading to reduced performance or even failure.
  • FODM611R2 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's power dissipation and ensure proper heat sinking to maintain reliable operation.
  • To protect FODM611R2 from ESD, handle the device by the body or use an anti-static wrist strap. Ensure the PCB is designed with ESD protection in mind, using components like TVS diodes or ESD protection arrays.

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FODM611R2 Overview

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