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FQD3P50TM-F085 - onsemi

Description: 500V P-CHANNEL MOSFET

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FQD3P50TM-F085 Details

  • Manufacturer Part Number:

    FQD3P50TM-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-252 3L (DPAK)

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369AS

  • Reach Compliance Code:

    Not Compliant

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    250 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    2.1 A

  • Drain-source On Resistance-Max:

    4.9 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    12 pF

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    50 W

  • Pulsed Drain Current-Max (IDM):

    8.4 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    180 ns

  • Turn-on Time-Max (ton):

    155 ns

FQD3P50TM-F085 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for FQD3P50TM-F085 is a 5-pin TO-220 package with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • To ensure reliability in high-temperature applications, ensure that the device is operated within the recommended junction temperature range (TJ) of -55°C to 150°C, and provide adequate heat sinking to maintain a safe operating temperature.
  • The maximum allowed voltage transient for FQD3P50TM-F085 is 50V for a duration of less than 100ms, as specified in the datasheet.
  • Yes, FQD3P50TM-F085 can be used in switching applications, but ensure that the device is operated within the recommended switching frequency range (typically up to 100kHz) and provide adequate snubbing to prevent voltage spikes.
  • To protect FQD3P50TM-F085 from ESD, handle the device with anti-static wrist straps, mats, or bags, and ensure that the PCB is designed with ESD protection in mind, such as using ESD diodes or resistors.

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FQD3P50TM-F085 Overview

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Part Image FQD3P50TM Fairchild Semiconductor Corporation

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Part Image FQD3P50TF Fairchild Semiconductor Corporation

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Part Image FQD3P50TM_F085 onsemi

500V P-Channel MOSFET, TO-252 3L (DPAK), 30000-TAPE REEL