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HD3SS3212IRKSR - Texas Instruments

Description: USB 3.1 Two Channel Differential 2:1/1:2 10Gbps Mux/Demux Switch

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PCB Footprints
HD3SS3212IRKSR - Texas Instruments PCB footprint - Other - Other - RKS0020A_2023
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3D Models
HD3SS3212IRKSR - Texas Instruments  - 3D model - Other - RKS0020A_2023
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HD3SS3212IRKSR Details

  • Manufacturer Part Number:

    HD3SS3212IRKSR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    20

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Configuration : 2:1 SPDT

  • Analog IC - Other Type:

    DIFFERENTIAL MULTIPLEXER

  • Bandwidth-Nom:

    8000 MHz

  • Input Voltage-Max:

    4.5 V

  • JESD-30 Code:

    R-PQCC-N20

  • JESD-609 Code:

    e4

  • Length:

    4.5 mm

  • Moisture Sensitivity Level:

    2

  • Normal Position:

    NO

  • Number of Channels:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Off-state Isolation-Nom:

    75 dB

  • On-state Resistance Match-Nom:

    0.5 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.1X.18,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    0.8 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    500 ns

  • Switch-on Time-Max:

    500 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.5 mm

HD3SS3212IRKSR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the high-speed signals away from the edges of the board. Additionally, use a common mode filter and a shielded cable to minimize EMI.
  • The HD3SS3212IRKSR requires a 1.8V to 3.3V power supply, and it's recommended to power the device in the following sequence: VCC, then VCCIO, and finally VREF. Ensure a clean power supply with minimal noise and ripple.
  • The HD3SS3212IRKSR has a maximum junction temperature of 125°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Avoid blocking the airflow around the device and ensure the PCB is designed for good thermal conductivity.
  • Use an oscilloscope to check the signal integrity and ensure the device is properly powered. Check the PCB layout for any signal routing issues, and verify that the device is properly configured. Consult the datasheet and application notes for troubleshooting guides and FAQs.
  • The HD3SS3212IRKSR requires a 50Ω termination for the high-speed signals. Ensure the input and output signals are properly terminated, and use a signal integrity analysis tool to simulate and optimize the signal transmission.

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HD3SS3212IRKSR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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